| Room-temperature intermediate layer bonding for microfluidic devices | |
Bart, Jacob1; Tiggelaar, Roald1; Yang, Menglong2,3 ; Schlautmann, Stefan1; Zuilhof, Han2; Gardeniers, Han1
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| 2009 | |
| 发表期刊 | LAB ON A CHIP
 |
| ISSN | 1473-0197 |
| 卷号 | 9期号:24页码:3481-3488 |
| 摘要 | In this work a novel room-temperature bonding technique based on chemically activated Fluorinated Ethylene Propylene (FEP) sheet as an intermediate between chemically activated substrates is presented. Surfaces of silicon and glass substrates are chemically modified with APTES bearing amine terminal groups, while FEP sheet surfaces are treated to form carboxyl groups and subsequently activated by means of EDC-NHS chemistry. The activation procedures of silicon, glass and FEP sheet are characterized by contact angle measurements and XPS. Robust bonds are created at room-temperature by simply pressing two amine-terminated substrates together with activated FEP sheet in between. Average tensile strengths of 5.9 MPa and 5.2 MPa are achieved for silicon-silicon and glass-glass bonds, respectively, and the average fluidic pressure that can be operated is 10.2 bar. Moreover, it is demonstrated that FEP-bonded microfluidic chips can handle mild organic solvents at elevated pressures without leakage problems. This versatile room-temperature intermediate layer bonding technique has a high potential for bonding, packaging, and assembly of various (bio-) chemical microfluidic systems and MEMS devices.; In this work a novel room-temperature bonding technique based on chemically activated Fluorinated Ethylene Propylene (FEP) sheet as an intermediate between chemically activated substrates is presented. Surfaces of silicon and glass substrates are chemically modified with APTES bearing amine terminal groups, while FEP sheet surfaces are treated to form carboxyl groups and subsequently activated by means of EDC-NHS chemistry. The activation procedures of silicon, glass and FEP sheet are characterized by contact angle measurements and XPS. Robust bonds are created at room-temperature by simply pressing two amine-terminated substrates together with activated FEP sheet in between. Average tensile strengths of 5.9 MPa and 5.2 MPa are achieved for silicon-silicon and glass-glass bonds, respectively, and the average fluidic pressure that can be operated is 10.2 bar. Moreover, it is demonstrated that FEP-bonded microfluidic chips can handle mild organic solvents at elevated pressures without leakage problems. This versatile room-temperature intermediate layer bonding technique has a high potential for bonding, packaging, and assembly of various (bio-) chemical microfluidic systems and MEMS devices. |
| 文章类型 | Article |
| 学科领域 | 公共实验 |
| WOS标题词 | Science & Technology ; Life Sciences & Biomedicine ; Physical Sciences |
| DOI | 10.1039/b914270c |
| 关键词[WOS] | ATOMIC-FORCE MICROSCOPY ; SILICON-WAFERS ; GOLD NANOPARTICLES ; MEMBRANE VALVES ; FABRICATION ; SURFACE ; PLASMA ; PUMPS ; METALLIZATION ; POLYMERS |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS研究方向 | Biochemistry & Molecular Biology ; Chemistry ; Science & Technology - Other Topics |
| WOS类目 | Biochemical Research Methods ; Chemistry, Multidisciplinary ; Nanoscience & Nanotechnology |
| WOS记录号 | WOS:000272142200003 |
| 引用统计 | |
| 文献类型 | 期刊论文 |
| 条目标识符 | http://ir.qibebt.ac.cn/handle/337004/372 |
| 专题 | 公共实验室 |
| 作者单位 | 1.Univ Twente, MESA Inst Nanotechnol, NL-7500 AE Enschede, Netherlands 2.Wageningen Univ, Organ Chem Lab, NL-6703 HB Wageningen, Netherlands 3.Chinese Acad Sci, Qingdao Inst Bioenergy & Bioproc Technol, Publ Lab Bioenergy & Bioproc, Qingdao 266101, Peoples R China |
| 推荐引用方式 GB/T 7714 | Bart, Jacob,Tiggelaar, Roald,Yang, Menglong,et al. Room-temperature intermediate layer bonding for microfluidic devices[J]. LAB ON A CHIP,2009,9(24):3481-3488. |
| APA | Bart, Jacob,Tiggelaar, Roald,Yang, Menglong,Schlautmann, Stefan,Zuilhof, Han,&Gardeniers, Han.(2009).Room-temperature intermediate layer bonding for microfluidic devices.LAB ON A CHIP,9(24),3481-3488. |
| MLA | Bart, Jacob,et al."Room-temperature intermediate layer bonding for microfluidic devices".LAB ON A CHIP 9.24(2009):3481-3488. |
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