含苯并二噻吩的聚芳基乙炔撑半导体材料

QIBEBT-IR > 专利信息

	含苯并二噻吩的聚芳基乙炔撑半导体材料
	中国科学院青岛生物能源与过程研究所
	2013-11-27
Patent Number	CN103408732A
Application Number	CN201310277740.5
Open (Notice) Number	CN103408732A
Document Type	专利
Identifier	http://ir.qibebt.ac.cn/handle/337004/13336
Collection	专利信息
Recommended Citation GB/T 7714	中国科学院青岛生物能源与过程研究所. 含苯并二噻吩的聚芳基乙炔撑半导体材料. CN103408732A[P]. 2013-11-27.

Files in This Item:
There are no files associated with this item.

Related Services

Bookmark

Google Scholar

Similar articles in Bing Scholar

Terms of Use

No data!

Social Bookmark/Share

All comments (0)

No comment.

The comment function is only available to registered usersLog In

If you have any objections to this item, please fill out the form below and the administrator will contact you as soon as possible.
Content:
Email：	*
Institution:
Verification Code:	Refresh

Any comments and suggestions are welcomed.
Title:	*
Content:
Email：	*
Verification Code:	Refresh

中国科学院青岛生物能源与过程研究所机构知识库